Apple’s iPhone SE is now available in various countries and first tear down of iPhone SE has been posted by the folks at Chipworks. The teardown of iPhone SE reveals that the latest 4-inch iPhone has a mixture of components found in the Phone 5s, iPhone 6 and iPhone 6s.
As per the reports the processor inside the iPhone SE is the same A9 processor found in the iPhone 6s with a chip labelled a part number APL1022 which means it is from Apple partner Taiwan Semiconductor Manufacturing Company. The 1604 date code suggests that the chip was produced 9 weeks before, has the same SK Hynix memory and 2GB LPDDR4 RAM is same found in the iPhone 6s.
The NFC module, NXP 66v10 and the 6-axis intertial sensor found in the iPhone SE are also found in the iPhone 6s.
The touchscreen controllers the Broadcom BCM5976 and Texas Instruments 343S0645 were used by Apple in the iPhone 5s.
The Qualcomm MDM9625M modem and the WTR1625L RF transceiver are used in the iPhone 6/6 Plus.
What is new in iPhone SE?
The new iPhone SE has new components a Skyworks SKY77611 power amplifier module, a Texas Instruments 338S00170 power management IC, Toshiba NAND flash, an EPCOS D5255 antenna switch module and AAC Technologies’ 0DALM1 microphone. It has got a new power management IC
Apple announced the launch of the iPhone SE this month at an event, the device will hit US market on March 31. The pre-orders of the iPhone SE is more than 3.4 million units in China.
By introducing iPhone SE Apple is going to capture the smartphone market of India and China. iPhone SE is going to attract first time iPhone buyers and many Android users who prefer small sized devices.